Introduction to the Master’s Program in Silicon Photonics and Advanced Semiconductor Technology at National Chung Cheng University

I. Background and Establishment

In response to the rapid development of artificial intelligence (AI), high-performance computing (HPC), high-speed communications, and data centers, silicon photonics, which integrates semiconductor manufacturing processes with photonic technologies, has emerged as a key technology for high-speed computing, optical interconnects, and next-generation semiconductor development through optoelectronic integration and advanced packaging.

National Chung Cheng University (CCU) was approved to establish the Master’s Program in Silicon Photonics and Advanced Semiconductor Technology in Academic Year 2027. The program focuses on silicon photonic devices, photonic integrated circuits (PICs), semiconductor manufacturing processes, advanced packaging, and system integration. It aims to cultivate highly skilled R&D professionals with interdisciplinary expertise and international competitiveness.

Located in Chiayi, National Chung Cheng University is in close proximity to the Chiayi Science Park and the semiconductor industry clusters in southern Taiwan. By integrating regional industrial resources, the program will promote industry–academia collaboration, industry-based practical training, and project-based research, preparing the next generation of semiconductor professionals to meet the needs of the industry.

II. Program Highlights

The program integrates interdisciplinary faculty expertise and research resources from the fields of electrical engineering, communications, mechanical engineering, computer science, chemical engineering, and physics. It establishes a comprehensive talent-development framework covering fundamental theories, device design, IC design, semiconductor manufacturing, advanced packaging, and system applications.

Through this integrated curriculum, students will develop capabilities in design, manufacturing, integration, and application, while acquiring the interdisciplinary skills needed to address real-world engineering challenges.

Stage	Core Learning Areas
📚 Fundamental Theories	Semiconductor Physics, Optoelectronic Physics, Materials Science
💡 Device Technology	Optical Waveguides, Light Sources, Photodetectors, Optoelectronic Devices
🖥️ IC Design	Digital IC Design, SoC, Embedded Systems
⚙️ Process Technology	Semiconductor Manufacturing Processes, Microfabrication, Heterogeneous Integration
📦 Advanced Packaging	Optoelectronic Packaging, Thermal Management, Reliability
🚀 System Applications	Optical Interconnects, Optical Communications, AI, High-Performance Computing

III. Academic and Graduation Requirements

[To be completed in accordance with the official regulations of the program.]

IV. Career Opportunities for Graduates

With the continued development of AI, high-performance computing, high-speed data transmission, and advanced packaging technologies, the semiconductor industry is experiencing growing demand for professionals with expertise spanning optoelectronics, electronics, semiconductor processes, and system integration.

Graduates of the program may pursue careers in the following fields according to their areas of expertise:

Industry Area	Potential Career Paths
🏭 Semiconductor Industry	Semiconductor Process Engineer, Device R&D Engineer, IC Design Engineer
🔬 Silicon Photonics / Optoelectronics	Silicon Photonics R&D Engineer, Optoelectronic Integration Engineer, Photonic IC Design Engineer
📦 Advanced Packaging	Advanced Packaging Engineer, Packaging and Testing Engineer, Heterogeneous Integration Engineer
💻 AI / High-Performance Computing	AI Chip Application Engineer, High-Speed Interconnect Engineer, System Integration Engineer
🤖 Smart Manufacturing	Semiconductor Smart Manufacturing Engineer, Automation Engineer, Process Integration Engineer
🎓 Research and Development	Ph.D. Programs, Research Institutions, R&D Positions in Academia and Industry

V. The Three WHYS

WHY JOIN｜What Will You Learn?

Optoelectronics × Semiconductors × IC Design × Manufacturing Processes × Packaging × AI

From fundamental theories to system applications, students will develop a comprehensive understanding of the interdisciplinary core technologies of silicon photonics and advanced semiconductors.

WHY NOW｜Why Study It Now?

AI × HPC × High-Speed Communications × Next-Generation Semiconductors

The rapid growth of AI, high-performance computing, and high-speed communications is driving increasing demand for professionals with expertise in silicon photonics, advanced packaging, and AI chip technologies.

WHY CAREER｜Where Can You Go After Graduation?

Wafer Fabrication｜IC Design｜Silicon Photonics｜Optoelectronics｜Advanced Packaging｜AI Chips｜Smart Manufacturing｜Research Institutions

The program connects students with the semiconductor and high-tech industries while opening up diverse career opportunities in R&D, engineering, and advanced research.